MICRO POGO CONNECTOR SOLUTIONS

ULTRA-MINIATURE
CONNECTORS FOR
AI SERVER SYSTEMS

Advanced micro pogo pin technology enables high-density connections for GPU computing, AI accelerator cards and next-generation servers.

High-Speed Connectivity for AI Servers AI COMPUTING High-Speed Connectivity
for AI Servers

Support GPU sockets, high-speed board-to-board interconnects, rack systems and AI platforms.

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Precision Connection for Humanoid Robots ROBOTICS Precision Connection
for Humanoid Robots

Enabling compact, reliable connections for robotic joints and intelligent systems.

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Semiconductor Test Probe Solutions SEMICONDUCTOR Semiconductor Test Probe
Solutions

Reliable electrical contact for advanced semiconductor test.

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INDUSTRY SOLUTIONS

Precision Connection Solutions

TOP-LINK provides precision connector solutions for AI servers, semiconductor testing, robotics, and advanced electronics.

High-Density Connection Solutions CONSUMER ELECTRONICS High-Density Connection
Solutions

Compact, high-durability contacts for diverse electronic applications.

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OUR ADVANTAGE

Why Top-Link?

Your Trusted Partner for High-Performance Precision Interconnect Solutions

We combine proprietary product design, advanced interconnect technology and precision engineering to deliver high-performance solutions for AI servers, semiconductor testing and next-generation electronics.

With innovative product platforms and engineering expertise, Top-Link enables reliable connectivity solutions for demanding applications worldwide.

Proprietary Interconnect Products

Self-developed Micro Pogo, Pogo Pin and high-speed interconnect solutions.

High-Speed Signal Integrity Technology

Advanced signal integrity technology for high-speed and reliable connectivity.

Micro-Scale Precision Engineering

Ultra-fine pitch engineering for next-generation interconnect applications.

Customized Solution Development

From design to mass production, delivering tailored interconnect solutions.

Engineering & Manufacturing Excellence:

100B+ Annual Production Capacity
0.35mm Ultra Fine Pitch Capability
224Gbps High-Speed Interconnect
233 Granted Patents

Trusted by Global Technology Leaders

Trusted by leading companies across AI, semiconductor and advanced electronics industries...